Compressor and method of laminating substrate using tbga type semiconductor package using it

专利摘要:
PURPOSE: A compression unit and a method of laminating a substrate for TBGA(Tape Ball Grid Array) semiconductor package using the same are provided to discharge the air from a center part between a tap tape and a ground plane by applying the pressure from the center part to the edge part of the tap tape. CONSTITUTION: A compression unit includes a silicon pad for compressing a target under the predetermined pressure. One end of the silicon pad is formed with a round shape. A diameter of a center of the silicon pad is larger than the diameter of an edge of the silicon pad. In a method of laminating s substrate for TBGA semiconductor package using the compression unit, a ground plane is adhered on a heat-sink plate by using an adhesive tape. The first rolling process is performed on the ground plane. The heat-sink plate and the ground plane are punched in strip units. A tap tape is adhered on the ground plane. The heat-sink plate and the ground plane are compressed by using the compression unit.
公开号:KR20040061843A
申请号:KR1020020088143
申请日:2002-12-31
公开日:2004-07-07
发明作者:김기덕；배동수；이명호；김근식；이구홍
申请人:주식회사 칩팩코리아；
IPC主号:

专利说明:

Crushing Mechanism and Lamination Method for TV-A Semiconductor Package Substrate Using the Same {COMPRESSOR AND METHOD OF LAMINATING SUBSTRATE USING TBGA TYPE SEMICONDUCTOR PACKAGE USING IT}
[14] The present invention relates to a crimping mechanism and a stacking method of a substrate package using the same, and more particularly, a crimping mechanism and a TV using the same for reliably proceeding a process of laminating a heat sink, a ground plate, and a ground plate and a tape. A method of stacking a substrate for a TAGA (Tape Ball Grid Array semiconductor package).
[15] In the field of semiconductor package manufacturing, it is known to apply Tape Atomated Bonding (TAB). The tape is a tape having an adhesive layer and an insulating layer so that a predetermined circuit pattern can be formed thereon, which is attached to a ground plane having a cavity, and the semiconductor chip is attached to a heat sink that is opened by a cavity of the ground plate. Is installed. The bonding pad of the semiconductor chip is electrically connected to the circuit pattern of the tape tape and the ground plate through wire bonding.
[16] The TV package using the tape and heat sink can accommodate high-density circuits, have excellent electrical characteristics, and have high heat dissipation, so it is mainly used for custom products such as computer graphics cards and game cards. do.
[17] In general, the TV package includes a tape tape having a circuit pattern bonded to a bonding pad of a semiconductor chip, a heat sink for dissipating heat generated from the semiconductor chip to the outside, and a ground plate interposed between the heat sink and the tape. It is configured by. At this time, the heat dissipation plate and the ground plate are maintained in a state of being bonded to each other by an adhesive tape. In addition, a silicon roller is used as a crimping mechanism for attaching the heat sink and the ground plate, and a silicon rod and a silicon rod are used to attach the tab tape and the ground plate.
[18] 1 is a perspective view illustrating a method of stacking a substrate for a TVA semiconductor package according to the prior art.
[19] In addition, Figure 2 is a crimping mechanism of the TVA semiconductor package according to the prior art
[20] 3 is a perspective view illustrating an enlarged cross-sectional view of portion A of FIG. 2.
[21] In the stacking process of a TV-use semiconductor package substrate according to the prior art, the heat sink, the ground plate, and the ground plate and the tap tape are sequentially bonded so as to be integrated by applying heat and pressure, and are performed in an in-line manner.
[22] Referring to the stacking process of the substrate for the TV package according to the prior art in more detail, as shown in Figure 1, first, the heat sink 12 is fixed on the block 10 by a vacuum adsorption method, and then An adhesive tape (not shown) is interposed between the heat sink 12 and the ground plate 14. Then, the ground plate 14 is rolled using a roller 18 to attach them. Then, as shown in FIG. 2, the tap tape 16 is fixed on the ground plate 14, and then the tap tape (using a stiffener 20 to which a silicon pad 22 is attached) is attached. The pressure is applied to the ground plate 14 by applying a predetermined pressure to 16). At this time, the silicon pad 22 of the stiffener 20 is, as shown in Figure 3, the diameter of the edge portion and the central portion of one end having the same shape, the same pressure on the center portion and the edge portion of the tap tape Press to.
[23] However, in the prior art, in the step of pressing the tap tape to the ground plate by using the silicon pad of the stiffener, the silicon pad presses the center portion and the edge portion of the tap tape with the same pressure, so that the heat sink and the ground plate are separated. The air in the central portion was not completely released to the outside, causing voids in the central portion.
[24] In addition, in the present invention, since the lamination process of the heat sink, the ground plate, and the ground plate and the tab tape is performed inline, misalignment and reliability problems between the heat sink, the ground plate, and the tape are generated after the final lamination process is completed. There is a concern. Accordingly, the present invention has been made to solve the above problems, the compression of the TV A semiconductor package that can prevent the occurrence of voids in the center portion between the heat sink and the ground plate and misalignment between the heat sink, the ground plate and the tap tape The purpose is to provide a mechanism.
[25] Another object of the present invention is to provide a method of stacking a substrate for a TV A semiconductor package that can prevent the generation of voids in the center portion between the heat sink and the ground plate and misalignment between the heat sink, the ground plate and the tap tape. .
[1] 1 is a perspective view for explaining a stacking method of a TVA semiconductor package according to the prior art.
[2] Figure 2 is a perspective view for explaining the crimping mechanism of the TVA semiconductor package according to the prior art.
[3] 3 is an enlarged cross-sectional view of portion A of FIG. 2;
[4] Figure 4 is a process flow chart for explaining the stacking method of a TV A semiconductor package according to the present invention.
[5] 5 is a perspective view for explaining a stacking method of a TV A semiconductor package according to the present invention.
[6] Figure 6 is a perspective view for explaining a crimping mechanism of the TVA semiconductor package according to the present invention.
[7] FIG. 7 is an enlarged cross-sectional view of part B of FIG. 5;
[8] 8A to 8C are diagrams for explaining a method of pressing a step tape by using the pressing mechanism of the present invention.
[9] Explanation of symbols for main parts of the drawings
[10] 100. Block 112. Heat Sink
[11] 114. Ground plate 116. Tap tape
[12] 118. Roller 120. Crimping Rod
[13] 122. Silicone Pad
[26] In order to achieve the above object, the crimping mechanism of the TV package of the present invention is characterized by including a silicon pad rounded so that one end has a rounded shape and the diameter of one end portion is larger than the center portion.
[27] According to the present invention, a method of stacking a substrate for a TV package for semiconductor packages includes attaching a ground plate on a heat sink, performing a first rolling process on the ground plate, and a heat sink and ground plate on which the first rolling process is completed in strip units. Slot punching, attaching the tap tape onto the punched ground plate, and applying pressure from the center portion of the tap tape to the edge direction by using the above-described crimping mechanism of the present invention. Releasing and compressing air to the outside, performing a second rolling process on the step tape, and performing a heat treatment on the resultant product.
[28] The heat treatment includes proceeding for 60 to 120 minutes at a temperature of 100 to 150 ℃.
[29] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[30] 4 is a flowchart illustrating a method of stacking a substrate for a TVA semiconductor package according to the present invention. 5 is a perspective view illustrating a method of stacking a TVA semiconductor package according to the present invention.
[31] 6 is a perspective view illustrating a crimping mechanism of a TVA semiconductor package according to the present invention, and FIG. 7 is an enlarged cross-sectional view of part B of FIG. 6.
[32] In the method of stacking the substrate for the TV package according to the present invention, as shown in FIGS. 4 and 5, first, the heat sink 112 is fixed on the block 100 by a vacuum suction method, and then the heat sink 112. Fix the ground plate 114 on the top. Subsequently, the first rolling process is performed on the ground plate 114 using the roller 118 to attach them. Subsequently, the heat dissipating plate 112 and the ground plate 114 having the attachment process are slot-punched in strip units by using a punch (not shown), and then the tap tape 116 is fixed on the punched ground plate. At this time, the step tape 116 is composed of a tape having an adhesive layer and an insulating layer so that a predetermined circuit pattern (not shown) can be formed thereon.
[33] Thereafter, the tap tape 116 is pressed by the pressing rod 120 to which the silicon pad 122 is attached, and the tap tape 116 is completely attached to the ground plate 14 by three down operations. At this time, the silicon pad 122 of the pressing rod 120, as shown in Figure 7, one end is in contact with the ground plate is round, has a shape that the diameter is larger toward the center portion from the edge portion of one end.
[34] Then, the secondary rolling by the roller is performed to attach the step tape 116 and the ground plate 114.
[35] After that, the resultant is heat treated. At this time, the heat treatment is performed for 60 to 120 minutes at a temperature of 100 to 150 ℃, preferably proceed for 60 minutes at 100 ℃ or 120 minutes at 150 ℃.
[36] 8A to 8C are views for explaining a method of pressing the tape to the ground plate by using the pressing mechanism of the present invention.
[37] Referring to the process of pressing the step tape to the ground plate by using the silicon pad 122 of the pressing rod 120 having the shape as follows.
[38] First, as shown in FIG. 8A, the pressing rod 122 is first lowered in the direction of being positioned on the ground plate 116 to which the tape tape 118 is attached. Then, as shown in FIG. The pressing rod subjected to the first lowering operation is second lowered again so that the silicon pad 122 of the pressing rod is in contact with the center portion of the tap tape 116.
[39] Subsequently, as shown in FIG. 8C, the stiffener is third-lowered again so that the silicon pad 122 is compressed not only with the center portion of the tap tape but also with the edge portion. In this process, the air of the center portion between the tap tape and the ground plate contacting the silicon pad 122 is discharged to the outside and the front of the tap tape 116 is pressed onto the ground plate 114.
[40] In the present invention, one end has a rounded shape, but by using a crimping mechanism including a silicon pad whose diameter increases from the edge portion of one end to the center portion, the center portion between the heat sink and the ground plate is formed using the silicon pad. Air can be released to the outside effectively.
[41] Therefore, voids can be prevented from occurring between the heat sink and the ground plate in advance, and the adhesion between them can be enhanced.
[42] In the present invention, the lamination process of the heat sink and the ground plate and the ground plate and the tape
[43] By proceeding in strip units rather than in-line, the possibility of misalignment between the heat sink, ground plate and tap tape after the final lamination process is completed can be minimized.
[44] As described above, in the present invention, the pressure between the tab tape and the ground plate is applied by applying pressure in the edge direction from the center portion of the tape to the tap using a crimping mechanism including a silicone pad that increases in diameter from one edge portion to the center portion. Since the air in the center portion can be effectively discharged to the outside, it is possible to prevent the occurrence of voids in advance and to enhance the adhesion between them.
[45] In the present invention, the lamination process of the heat sink and the ground plate and the ground plate and the tape
[46] As it proceeds in individual strip units rather than in-line, inspection of raw material defects is easy before the stacking process is performed in each step, thus minimizing the possibility of misalignment between the heat sink, ground plate, and tap tape after the final lamination process is completed. Can be.
[47] In addition, this invention can be implemented in various changes within the range which does not deviate from the summary.

权利要求:
Claims (3)
[1" claim-type="Currently amended] In the crimping mechanism for crimping by applying a predetermined pressure to an object with a silicone pad,
One end of the silicon pad has a rounded shape, the diameter of the end from the edge portion of the end of the crimping mechanism characterized in that the larger in diameter.
[2" claim-type="Currently amended] Attaching a ground plate with an adhesive tape on the heat sink;
Performing a first rolling process on the ground plate;
Slot punching the heat sink and ground plate of the first rolling process in strip units;
Attaching a tap tape on the punched ground plate;
Applying pressure from the center portion of the tap tape to the edge direction by using the crimping mechanism of claim 1 to release and pressurize air at the center portion between the heat sink and the ground plate to the outside;
Performing a second rolling process on the resultant tape;
And heat-treating the resultant product after the secondary rolling process is completed.
[3" claim-type="Currently amended] The method of claim 2, wherein the heat treatment is performed at a temperature of 100 to 150 ° C. for 60 to 120 minutes.

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同族专利:

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公开号 | 公开日

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KR100575584B1|2006-05-03|

引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2002-12-31|Application filed by 주식회사 칩팩코리아

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2002-12-31|Priority to KR20020088143A

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2004-07-07|Publication of KR20040061843A

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2006-05-03|Application granted

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2006-05-03|Publication of KR100575584B1

优先权:

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申请号 | 申请日 | 专利标题

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KR20020088143A|KR100575584B1|2002-12-31|2002-12-31|Compressor and method of laminating substrate using tbga type semiconductor package using it|